Nanoscale metallic glue could replace welding and soldering
Yahoo! - 01/18/2016
Researchers at Northeastern University have developed a new method for welding and soldering that does not require heat. The glue-like compound called MesoGlue bonds metals together at room temperature with minimal pressure needed to initiate a bond. “It’s like welding or soldering but without the heat,” says Hanchen Huang, professor and chair of Northeastern’s department of mechanical and industrial engineering.