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  • Nanoscale metallic glue could replace welding and soldering

    Yahoo! - 01/18/2016

    Researchers at Northeastern University have developed a new method for welding and soldering that does not require heat. The glue-like compound called MesoGlue bonds metals together at room temperature with minimal pressure needed to initiate a bond. “It’s like welding or sol­dering but without the heat,” says Hanchen Huang, pro­fessor and chair of Northeastern’s department of mechanical and industrial engineering.

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