Is this the 21st century’s duct tape?
Fortune - 01/13/2016
It’s called “MesoGlue” but it’s got more soldering-like power than anything Elmer’s makes.
A new glue that can stick metal to metal has been developed in a Northeastern University lab, opening the door to truly glue-able electronics.
Until now, adhering metal to metal has been a difficult, messy process or required soldering—fusing two parts together with a hot metal joint. Room-temperature glues can’t really compete with this method: They don’t conduct electricity and many break down in heat.
The new glue—a silvery-looking coating that could be used to bond pipe fittings, solar cells, or tiny conductive computer parts—is based on a system of metal-cored “nanorods” that are invisible to the eye. Lightly press two nanorod-coated surfaces together for about 30 seconds and you can glue metal to metal at room temperature, like soldering without the heat.
The finished bond is both conductive and withstands high heat, holding about 1500 pounds per square inch (psi) of pressure, higher than some metal solders.
Details of the research, led by Hanchen Huang, chair of the mechanical and industrial engineering department at Northeastern, were published this month in Advanced Materials and Processes.